QFN-32 (Quad Flat No-Lead 32-pin) has pads on the bottom edge of the package with a large exposed pad underneath for thermal dissipation. Used for wireless modules, power ICs, and RF chips requiring good thermal contact.
| Pin | Name | Function | Type |
|---|---|---|---|
| 1 | Pin 1 | Varies by IC (dot marks corner) | I/O |
| 8 | Pin 8 | Side 1 last | I/O |
| 9 | Pin 9 | Side 2 start | I/O |
| 16 | GND | Ground pin | GND |
| 17 | Pin 17 | Side 3 start | I/O |
| 24 | VCC | Supply pin | PWR |
| 25 | Pin 25 | Side 4 start | I/O |
| 32 | Pin 32 | Side 4 last | I/O |
| EP | Exposed Pad | Thermal and ground exposed pad bottom | GND |
QFN-32 (Quad Flat No-Lead 32-pin) has pads on the bottom edge of the package with a large exposed pad underneath for thermal dissipation. Used for wireless modules, power ICs, and RF chips requiring good thermal contact.