BGA-256 (Ball Grid Array 256-ball) is used for high-density ICs including FPGAs, processors, and memory chips where the solder balls on the bottom provide both electrical connection and mechanical mounting.
| Pin | Name | Function | Type |
|---|---|---|---|
| A1 | Ball A1 | Corner reference ball (marked) | I/O |
| B1 | Ball B1 | Second row first column | I/O |
| P16 | Ball P16 | Opposite corner | I/O |
| VCC | Power Balls | Multiple VCC balls distributed | PWR |
| GND | Ground Balls | Multiple GND balls distributed | GND |
BGA-256 (Ball Grid Array 256-ball) is used for high-density ICs including FPGAs, processors, and memory chips where the solder balls on the bottom provide both electrical connection and mechanical mounting.