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UFS 4.0 BGA On-Board

UFS 4.0 doubles UFS 3.1 bandwidth to 4200 MB/s using MIPI M-PHY Gen 5 lanes. Used in Samsung Galaxy S23 series and Qualcomm Snapdragon 8 Gen 2 flagships for ultra-fast app launch and camera buffer clearing.

// connector diagram 8 pins
// loading diagram...
// Specifications
Standard
JEDEC JESD220F UFS 4.0
Interface
2x MIPI M-PHY Gen 5
Max Read
4200 MB/s
Max Write
2800 MB/s
Mounting
BGA solder on PCB
Use Case
Flagship phones 2023 Snapdragon 8 Gen 2
// Pin Reference Table
PinNameFunctionType
REF_CLK REF_CLK Reference clock BUS
RST# RST# Device reset I/O
RXP0 RXP0 RX lane 0 positive Gen 5 BUS
RXN0 RXN0 RX lane 0 negative BUS
TXP0 TXP0 TX lane 0 positive Gen 5 BUS
TXN0 TXN0 TX lane 0 negative BUS
VCC VCC Power supply PWR
GND GND Ground GND

UFS 4.0 doubles UFS 3.1 bandwidth to 4200 MB/s using MIPI M-PHY Gen 5 lanes. Used in Samsung Galaxy S23 series and Qualcomm Snapdragon 8 Gen 2 flagships for ultra-fast app launch and camera buffer clearing.